PX7104 ADVANCED POWER SEMICONDUCTOR DEVICES L T P C 3 0 0 3
- To improve power semiconductor device structures for adjustable speed motor control applications.
- To understand the static and dynamic characteristics of current controlled power semiconductor devices
- To understand the static and dynamic characteristics of voltage controlled power semiconductor devices
- To enable the students for the selection of devices for different power electronics applications
- To understand the control and firing circuit for different devices.
UNIT I INTRODUCTION 9
Power switching devices overview – Attributes of an ideal switch, application requirements, circuit symbols; Power handling capability – (SOA); Device selection strategy – On-state and switching losses – EMI due to switching – Power diodes – Types, forward and reverse characteristics, switching characteristics – rating.
UNIT II CURRENT CONTROLLED DEVICES 9
BJT’s – Construction, static characteristics, switching characteristics; Negative temperature co- efficient and secondary breakdown; Power darlington – Thyristors – Physical and electrical principle underlying operating mode, Two transistor analogy – concept of latching; Gate and switching characteristics; converter grade and inverter grade and other types; series and parallel operation; comparison of BJT and Thyristor – steady state and dynamic models of BJT & Thyristor.
UNIT III VOLTAGE CONTROLLED DEVICES 9
Power MOSFETs and IGBTs – Principle of voltage controlled devices, construction, types, static and switching characteristics, steady state and dynamic models of MOSFET and IGBTs – Basics of GTO, MCT, FCT, RCT and IGCT.
UNIT IV FIRING AND PROTECTING CIRCUITS 9
Necessity of isolation, pulse transformer, optocoupler – Gate drives circuit: SCR, MOSFET, IGBTs and base driving for power BJT. – Over voltage, over current and gate protections; Design of snubbers.
UNIT V THERMAL PROTECTION 9
Heat transfer – conduction, convection and radiation; Cooling – liquid cooling, vapour – phase cooling; Guidance for hear sink selection – Thermal resistance and impedance -Electrical analogy of thermal components, heat sink types and design – Mounting types.
TOTAL : 45 PERIODS
- B.W Williams ‘Power Electronics Circuit Devices and Applications’.
- Rashid M.H., ” Power Electronics Circuits, Devices and Applications “, Prentice Hall India, Third Edition, New Delhi, 2004.
- MD Singh and K.B Khanchandani, “Power Electronics”, Tata McGraw Hill, 2001.
- Mohan, Undcland and Robins, “Power Electronics – Concepts, applications and Design, John Wiley and Sons, Singapore, 2000.